Tokuyama Universal Bond Kit
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Tokuyama Universal Bond Kit

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SKU:
TOK-15203
Brand
Tokuyama
UOM:
Kit
Current Stock:
2

Description

Bond Force is a seventh-generation single component light-cured dental adhesive that requires one single application to achieve award-winning bond strength. The self-leveling technology allows for a uniform adhesive layer that has a film thickness as thin as 8μm. Bond Force creates a 3-D fusion link to the tooth generating an extremely strong bond to enamel and dentin. While releasing fluoride and preventing post-op sensitivity, Bond Force requires only one application, and is designed to be used on both cut/uncut enamel and dentin.

Tokuyama Universal Bond Kit